Temperature stabilization for detector heads

ABSTRACT

An imaging system is provided that includes a gantry, plural radiation detector head assemblies, a cooling unit, and a manifold. The radiation detector head assemblies are disposed about a bore of the gantry. Each radiation detector head assembly includes a detector housing and a rotor assembly. The rotor assembly is configured to be rotated about an axis. The rotor assembly includes a detector unit that in turn includes an absorption member and associated processing circuitry. The cooling unit is mounted to the gantry and is configured to provide an output flow of air at a controlled temperature. The manifold is coupled to the cooling unit and the plural radiation detector head assemblies, and places the cooling unit and radiation detector head assemblies in fluid communication with each other. The output flow of air from the cooling unit is delivered to the plural radiation detector head assemblies.

BACKGROUND

The subject matter disclosed herein relates generally to medical imagingsystems, and more particularly to reduction of airborne radiationcontamination for detector heads.

In nuclear medicine (NM) imaging, such as single photon emissioncomputed tomography (SPECT) or positron emission tomography (PET)imaging, radiopharmaceuticals may be administered internally to apatient. Detectors (e.g., gamma cameras), typically installed on agantry, capture the radiation emitted by the radiopharmaceuticals andthis information is used, by a computer, to form images. The NM imagesprimarily show physiological function of for example, the patient or aportion of the patient being imaged. Detectors, however, may be subjectto changes in performance, or in changes to the signals produced bydetectors. For example, changes in temperature can affect the energylevels reported by a detector for radiation events impacting thedetector.

BRIEF DESCRIPTION

In accordance with an embodiment, an imaging system is provided thatincludes a gantry, plural radiation detector head assemblies, a coolingunit, and a manifold. The gantry has a bore. The radiation detector headassemblies are disposed about the bore of the gantry. Each radiationdetector head assembly includes a detector housing a rotor assembly. Therotor assembly is disposed within the detector housing and configured tobe rotated about an axis. The rotor assembly includes a detector unitthat in turn includes an absorption member and associated processingcircuitry. The cooling unit is mounted to the gantry and is configuredto provide an output flow of air at a controlled temperature. Themanifold is coupled to the cooling unit and the plural radiationdetector head assemblies, and places the cooling unit and radiationdetector head assemblies in fluid communication with each other. Theoutput flow of air from the cooling unit is delivered to the pluralradiation detector head assemblies.

In accordance with another embodiment, an imaging system includes apixelated detector and a processing unit. The pixelated detector hasindividually read pixels. The processing unit includes one or moreprocessors and at least one memory comprising a tangible andnon-transitory computer readable storage medium including instructionsconfigured to instruct the one or more processors to count eventsdetected by the detector units using a corresponding threshold andwindow for each pixel, wherein at least one of the threshold or thewindow are individually tailored for each pixel.

In accordance with another embodiment, a method includes acquiringradiation events with a pixelated detector having individually readpixels. The method also includes counting, with a processing unitcomprising at least one processor, the events detected by the pixelateddetector using a corresponding threshold and window for each pixel,wherein at least one of the threshold or the window are individuallytailored for each pixel.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 provides a schematic view of a nuclear medicine (NM) multi-headimaging system according to an embodiment.

FIG. 2 provides a schematic view of the system of FIG. 1 in an open looparrangement.

FIG. 3 provides a schematic view of the system of FIG. 1 in a closedloop arrangement.

FIG. 4 illustrates a schematic view of an air circulation systemaccording to an embodiment.

FIG. 5 provides a sectional schematic view of a radiation detector headassembly according to an embodiment.

FIG. 6 provides a side view of a radiation detector head assemblyaccording to an embodiment.

FIG. 7 depicts a side schematic view of fins according to an embodiment.

FIG. 8 depicts a schematic view of fins according to another embodiment.

FIG. 9 depicts a side schematic view of fins according to an embodiment.

FIG. 10 provides a schematic view of a pixelated detector, according toan embodiment.

FIG. 11 depicts a spectrum or signal, according to an embodiment.

FIG. 12 provides a flowchart of a method, according to an embodiment.

FIG. 13 shows a schematic view of an imaging system, according to anembodiment.

FIG. 14a depicts a telescoping assembly in an extended position,accordingly to an embodiment.

FIG. 14b depicts the telescoping assembly of FIG. 14a in a retractedposition.

FIG. 15 provides a flowchart of a method, according to an embodiment.

FIG. 16 provides a flowchart of a method, according to an embodiment.

FIG. 17 depicts a signal for deconvolution, according to an embodiment.

FIG. 18 provides a flowchart of a method, according to an embodiment.

DETAILED DESCRIPTION

The foregoing summary, as well as the following detailed description ofcertain embodiments and claims, will be better understood when read inconjunction with the appended drawings. To the extent that the figuresillustrate diagrams of the functional blocks of various embodiments, thefunctional blocks are not necessarily indicative of the division betweenhardware circuitry. Thus, for example, one or more of the functionalblocks (e.g., processors, controllers or memories) may be implemented ina single piece of hardware (e.g., a general purpose signal processor orrandom access memory, hard disk, or the like) or multiple pieces ofhardware. Similarly, the programs may be stand alone programs, may beincorporated as subroutines in an operating system, may be functions inan installed software package, and the like. It should be understoodthat the various embodiments are not limited to the arrangements andinstrumentality shown in the drawings.

As used herein, the terms “system,” “unit,” or “module” may include ahardware and/or software system that operates to perform one or morefunctions. For example, a module, unit, or system may include a computerprocessor, controller, or other logic-based device that performsoperations based on instructions stored on a tangible and non-transitorycomputer readable storage medium, such as a computer memory.Alternatively, a module, unit, or system may include a hard-wired devicethat performs operations based on hard-wired logic of the device.Various modules or units shown in the attached figures may represent thehardware that operates based on software or hardwired instructions, thesoftware that directs hardware to perform the operations, or acombination thereof.

“Systems,” “units,” or “modules” may include or represent hardware andassociated instructions (e.g., software stored on a tangible andnon-transitory computer readable storage medium, such as a computer harddrive, ROM, RAM, or the like) that perform one or more operationsdescribed herein. The hardware may include electronic circuits thatinclude and/or am connected to one or more logic-based devices, such asmicroprocessors, processors, controllers, or the like. These devices maybe off-the-shelf devices that are appropriately programmed or instructedto perform operations described herein from the instructions describedabove. Additionally or alternatively, one or more of these devices maybe hard-wired with logic circuits to perform these operations.

As used herein, an element or step recited in the singular and precededwith the word “a” or “an” should be understood as not excluding pluralof said elements or steps, unless such exclusion is explicitly stated.Furthermore, references to “one embodiment” are not intended to beinterpreted as excluding the existence of additional embodiments thatalso incorporate the recited features. Moreover, unless explicitlystated to the contrary, embodiments “comprising” or “having” an elementor a plurality of elements having a particular property may includeadditional such elements not having that property.

Various embodiments provide for improved control of temperature fordetectors, accordingly reducing changes in detector performance due tochange in temperature. Various embodiments provide controlledcirculation of air (e.g., cooling air) to detectors to one or more ofremove heat, remove moisture, or control temperature, thereby improvingperformance stability of radiation detectors. In various embodiments, asingle cooling unit may be utilized for plural groups of radiationdetector assemblies (e.g., plural radiation detector head assembliesdistributed about the bore of a gentry of an imaging system). Air ducts(e.g., flexible pipes, hoses, or the like) may be used to distributecold air to columns or detector head assemblies, and to return hot airto a cooling unit (or, alternatively, to exhaust hot air to anatmosphere). In some embodiments, hot air may be exhausted to anatmosphere via holes or opening in a column cover or a detector headcover. In some embodiments, each column or detector head assembly has anindividual fan urging cold air from the ducts to a detector head.

In various embodiments, a threshold (and/or window setting) isindividually set for each pixel (e.g., each pixel of a CZT detector).For example, the threshold may be set as low as possible while stillbeing high enough to not compromise the ability to detect real events.The threshold, for example, may be set high enough to avoid overwhelmingprocessing capabilities of an imaging system. A count rate for eachpixel in various embodiments is monitored, and the threshold may beadjusted if appropriate. Individual tailoring of pixel threshold invarious embodiments increases yield (by reducing the number of rejectedpixels or detectors), and/or allows for improved detection of relativelylower energy events (e.g., charge sharing events having energy split orshared between neighboring pixels). In some embodiments, the thresholdmay be adjusted based on changes in temperature.

Various embodiments provide adaptive energy windows for radiationdetectors (e.g., windows for counting radiation events that may be setand/or adjusted on a per pixel basis). For example, a correspondingenergy window may be defined for each pixel in a pixelated detector(e.g., CZT detector). For each pixel, the energy window may be optimizedto provide a trade-off between sensitivity and scatter. For example, forpixels with high energy resolution characteristics, narrow energywindows may be used. Poor performing pixels may not be turned off butmay instead be downwardly weighted in a resulting image, and may beaugmented by counts of neighboring pixels. In some embodiments,temperature sensors may be used to track temperature change and used toaccount for energy drift due to temperature change. In some embodiments,the leading edge (e.g., portion leading up to a peak) of a spectrum orsignal produced by a pixel may be used to adjust energy calibration. Theleading edge may be defined by a fraction or percentage of the number ofcounts for the energy level having the most counts.

In various embodiments, a calibration process may be performed in which,for each pixel, the energy response is measured at differenttemperatures, and the energy window for each pixel optimized for eachtemperature and application. For example, a first window for a givenpixel may be defined for high sensitivity applications, and a secondwindow for a given pixel may be defined for high resolutionapplications.

Various embodiments provide improved determination of the true energyresponse of a pixel. Knowledge of the true energy response of a pixelmay be utilized for qualifying the pixel and for correctly setting anenergy window for the pixel during imaging. To measure a true energyresponse, a pure single-peak source may be employed; however, suchsources may be difficult to obtain. Cobalt, for example, has two peaks.Technetium (Tc) is a single peak isotope; however Tc sources may haveinternal and/or container scatter or contamination from a shield usedwith the Tc source. In various embodiments, the energy response of thepixel may be obtained by computing a deconvolution process with a knowntrue spectrum of the source.

Various embodiments provide post-acquisition spectral analysis fordetector systems. For example, in some embodiments, in addition toproviding a diagnostic image, a list file containing all detected eventsduring an acquisition may be saved. Additional information such astiming information (e.g., time-ticks), temperature readings, cameramotion, or the like may also be saved. The information may then beutilized by one or more processors to perform post processing to producean updated model of the detector behavior, and/or to adjust settings(e.g., threshold and/or window). By providing improved accuracy, suchcalibration may allow the use of narrower energy windows to provideimproved imaging.

A technical effect of at least one embodiment includes improved imagequality (e.g., due to improved performance stability due to reduction intemperature changes). A technical effect of at least one embodimentincludes reduced cost of producing detectors (e.g., by increasingproduction yield). A technical effect of at least one embodimentincludes reduced maintenance costs (e.g., by reducing the number ofdetectors to be replaced). A technical effect of at least one embodimentincludes increased detector sensitivity.

FIG. 1 provides a schematic view of a nuclear medicine (NM) multi-headimaging system 100 in accordance with various embodiments. Generally,the imaging system 100 is configured to acquire imaging information(e.g., photon counts) from an object to be imaged (e.g., a humanpatient) that has been administered a radiopharmaceutical. The depictedimaging system 100 includes a gantry 110 having a bore 112 therethrough,plural radiation detector head assemblies 115, a cooling unit 130, amanifold 140, and a processing unit 120.

The gantry 110 defines the bore 112. The bore 112 is configured toaccept an object to be imaged (e.g., a human patient or portionthereof). As seen in FIG. 1, plural radiation detector head assemblies115 are mounted to the gantry 110. In the illustrated embodiment, eachradiation detector head assembly 115 includes an arm 114 and a head 116.The arm 114 is configured to articulate the head 116 radially towardand/or away from a center of the bore 112 (and/or in other directions),and the head 116 includes at least one detector, with the head 116disposed at a radially inward end of the arm 114 and configured to pivotto provide a range of positions from which imaging information isacquired.

The detector of the head 116, for example, may be a semiconductordetector. For example, a semiconductor detector various embodiments maybe constructed using different materials, such as semiconductormaterials, including Cadmium Zinc Telluride (CdZnTe), often referred toas CZT, Cadmium Telluride (CdTe), and Silicon (Si), among others. Thedetector may be configured for use with, for example, nuclear medicine(NM) imaging systems, positron emission tomography (PET) imagingsystems, and/or single photon emission computed tomography (SPECT)imaging systems.

In various embodiments, the detector may include an array of pixelatedanodes, and may generate different signals depending on the location ofwhere a photon is absorbed in the volume of the detector under a surfaceif the detector. (See also FIGS. 11 and 12, and related discussion.) Thevolumes of the detector under the pixelated anodes are defined as voxels(not shown in FIG. 1). For each pixelated anode, the detector has acorresponding voxel. The absorption of photons by certain voxelscorresponding to particular pixelated anodes results in chargesgenerated that may be counted. The counts may be correlated toparticular locations and used to reconstruct an image.

In various embodiments, each detector head assembly 115 may define acorresponding view that is oriented toward the center of the bore 112.Each detector head assembly 115 in the illustrated embodiment isconfigured to acquire imaging information over a sweep rangecorresponding to the view of the given detector unit. Additional detailsregarding examples of systems with detector units disposed radiallyaround a bore may be found in U.S. patent application Ser. No.14/788,180, filed 30 Jun. 2015, entitled “Systems and Methods ForDynamic Scanning With Multi-Head Camera,” the subject matter of which isincorporated by reference in its entirety.

The processing unit 120 includes memory 122. The imaging system 100 isshown as including a single processing unit 120; however, the block forthe processing unit 120 may be understood as representing one or moreprocessors that may be distributed or remote from each other. Thedepicted processing unit 132 includes processing circuitry configured toperform one or more tasks, functions, or steps discussed herein. It maybe noted that “processing unit” as used herein is not intended tonecessarily be limited to a single processor or computer. For example,the processing unit 120 may include multiple processors and/orcomputers, which may be integrated in a common housing or unit, or whichmay distributed among various units or housings.

Generally, various aspects (e.g., programmed modules) of the processingunit 120 act individually or cooperatively with other aspects to performone or more aspects of the methods, steps, or processes discussed herein(e.g., method 1200 or aspects thereof). In the depicted embodiment, thememory 122 includes a tangible, non-transitory computer readable mediumhaving stored thereon instructions for performing one or more aspects ofthe methods, steps, or processes discussed herein.

As mentioned above the imaging system 100 also includes a cooling unit130 and a manifold 140. FIG. 2 illustrates a schematic view of theimaging system 100 including the cooling unit 130 and manifold 140. Thecooling unit 130 in various embodiments is mounted to the gantry 110(e.g., mounted proximate to an interior cavity or housing within thegantry 110). Generally, the cooling unit 130 is configured to provide anoutput flow 132 of air at a controlled temperature. The output flow 132is provided to the detector head assemblies 115, for example to cool orstabilize temperatures of detector electronics, as the electronics tendto heat up as they are activated or used. In some embodiments, thecooling unit 130 may be a thermoelectric chiller (TEC).

As schematically depicted in FIG. 2, the manifold 140 is coupled to thecooling unit 130 and to the radiation detector head assemblies 115. Forexample, the manifold 140 may include one or more of pipes, tubes,hoses, or ducting, for example, that define a fluid pathway between thecooling unit 130 and the radiation detector head assemblies 115. Thedepicted manifold 140 places the cooling unit 130 in fluid communicationwith the radiation detector head assemblies 115. As seen in FIG. 2, theoutput flow 132 of air from the cooling unit 130 is delivered to theradiation detector head assemblies 115. By using one cooling unit 130for all of the radiation detector head assemblies 115, consistency ofcontrol of air temperature for air provided to the radiation detectorhead assemblies may be improved, and/or cost for the imaging system 100may be reduced by using only one cooling unit 130 instead of separatecooling units mounted on each radiation detector head assembly 115.Accordingly, in some embodiments, only a single cooling unit 130 may beused for all of the radiation detector head assemblies 115 of the system100. In other embodiments, more than one cooling unit 130 may beemployed (e.g., with each cooling unit contributed to an output flowshared among the radiation detector head assemblies, or with eachcooling unit providing an output flow to a dedicated group of theradiation detector head assemblies).

It may be noted that the distribution of air for the imaging system 100may be configured as an open loop distribution or a closed loopdistribution. FIG. 2 illustrates the imaging system 100 in an open loopair distribution configuration. In FIG. 2, the cooling unit 130 receivesan inlet flow 134 from an atmospheric source. A fan 154 in theillustrated embodiment is used to provide the inlet flow 134 to thecooling unit 130 for distribution amount the radiation detector headassemblies 115. In some embodiments, the atmospheric source may belocated in the same room or immediate environment as the gantry 110. Insome embodiments, the atmospheric source may be located remotely (e.g.,in a different room) from the gantry 110, for example to reduce anypotential airborne contamination that may enter the air flow. After theoutput flow 132 is distributed to the radiation detector head assemblies115 and used to cool the radiation detector head assemblies 115, anexhaust flow 136 is routed away from the radiation detector headassemblies 115. For control of the cooling unit 130, fan 154, and/orother aspects of the system 100, a temperature sensor 152 sensestemperature of the output flow 132 and provides temperature informationto a temperature controller 156. Additional or alternative temperaturesensors may be used to sense temperatures of other flows, such as theinlet flow 134 and/or the exhaust flow 136.

As seen in FIG. 2, the cooling unit 130 may be considered as a cold sideof a heat exchange interface 131 (which may include a heat pump 133),that cooperates with heat exchanger 160 to remove heat from the coolingunit 130. The heat exchanger 160 may receive a flow 162 of room air inwhich is heated in the heat exchanger 160 and exhausted as a heated flow164 of room air out. Accordingly, heat removed from the radiationdetector head assemblies 115 may be removed from an enclosure 150surrounding the detection components and/or gantry of the system 100,with the heat transferred to an atmosphere outside of the enclosure 150via the heat exchanger 160.

FIG. 3 illustrates the imaging system 100 in a closed loop airdistribution configuration. In FIG. 3, after the output flow 132 isdistributed to the radiation detector head assemblies 115 and used tocool the radiation detector head assemblies 115, the exhaust flow 136 isrouted away from the radiation detector head assemblies 115 to thecooling unit 130 via an exhaust manifold 141. The example systemdepicted in FIG. 3 also includes a dessicator 170 configured to removemoisture from the exhaust flow 136 as it is returned to the cooling unit130. It may further be noted that, while not depicted in FIG. 3 for easeand clarity of depiction, the system of FIG. 3 may include generallysimilar components for heat exchange and temperature control asdiscussed in connection with the example of FIG. 2.

FIG. 4 illustrates a schematic view of an air circulation system 400 foran imaging system (e.g., imaging system 100). Only one radiationdetector head assembly is shown in FIG. 4 for clarity and ease ofillustration; however, similar arrangements may be provided for pluralradiation detector head assemblies of a given imaging system. As seen inFIG. 4, a radiation detector head assembly 410 includes an arm 412 and ahead 414. A passageway 416 is defined between a housing 418 and a rotorassembly 420. A detector unit (not shown in FIG. 4) is disposed withinthe rotor assembly 420. As seen in FIG. 4, a cooling flow 432 of coolingair (e.g., from cooling unit 130) travels through a cooling manifold440. An inlet 442 places the cooling manifold 440 in fluid communicationwith the passageway 416 of the radiation detector head assembly 410.Accordingly, air from the cooling flow 432 may be diverted from thecooling manifold 440 to the passageway 416 and used to cool the rotorassembly 420 (e.g., an electronic detector within the rotor assembly420). A fan 450 in the illustrated embodiment helps direct the air in adesired direction through the passageway 416, while a valve 452 is usedto control an amount of air diverted from the cooling manifold 440 tothe passageway 416. Additionally or alternatively, in some embodiments,a fan 490 assists or causes air flow into the rotor assembly 420.Optionally, each fan 490 may be controlled to vary the volume of airthrough the rotor assembly 420 it serves in order to control andstabilize the temperature in the rotor assembly 420 it serves. After theair has passed and cooled the rotor assembly 420, the air is directedvia the passageway to an outlet 444, which is in fluid communicationwith an exhaust manifold 441. The exhaust manifold 441 may be configuredto route air back to a cooling source (e.g., cooling unit 130) in aclosed air distribution configuration, or may be configured to routeexhausted air to an atmosphere in an open air distributionconfiguration. The cooling manifold 440 and the exhaust manifold 441,for example, may be disposed within a gantry (e.g., gantry 110). It maybe noted that one or more aspects of the air circulation system 400(e.g., inlet 442 and/or outlet 444) may be configured to allow forextension and/or retraction of the arm 412 to translate the head 414radially within a bore of a gantry. For example, the inlet 442 and/oroutlet 444 may include a length of flexible hose. In the illustratedembodiment, a flexible hose 470 extends from the inlet 442 to an airinlet of the rotor assembly 420 to direct cooling air to electronics ofthe radiation detector head assembly 410. Optionally, a generallysimilar flexible hose (not shown in FIG. 4) may extend from an exhaustoutlet of the rotor assembly 420 to direct spent cooling air to theexhaust manifold 441. Flexibility of the air hose accounts for theradial motion of rotor assembly 420 respective to the gantry. Directingair from the cooling manifold 440 through the rotor assembly 420 to theexhaust manifold 441 helps provide efficient cooling.

Alternatively or additionally, a telescoping baffle arrangement may beused to direct air to the electronics of the radiation detector headassembly while permitting the detector head assembly to articulateradially inwardly and outwardly. FIG. 14a depicts a telescoping assembly1400 in an extended position and FIG. 14b depicts the telescopingassembly 1400 in a retracted position. In FIGS. 14a and 14b , thetelescoping assembly 1400 is shown along an axial cross-section. Thetelescoping assembly includes an arm 1410 with a telescoping arm portion1420. The telescoping assembly 1410 also includes a telescoping septum1430 that divides the telescoping assembly 1400 and defines a passagewaythrough which cooling air flow 1440 may pass through the interior of thetelescoping assembly 1400 to cool detector electronics 1450. In such away, the lumen in the gantry is divided to a cooling manifold (generallyequivalent to 440 in FIG. 4) and exhaust manifold (generally equivalentto 441 in FIG. 4), respectively, open to the two lumens on each side ofthe telescoping septum 1430. Accordingly, cooling air may be forced totraverse the detector electronics 1450.

As also discussed herein, in various embodiments, one or more signalprocessing characteristics of a detector (e.g., individual pixels of adetector), such as a window or threshold (see, e.g., FIG. 11 and relateddiscussion) may be varied based on temperature. The depicted aircirculation system 400 includes a temperature sensor 460 operablycoupled to a processing unit (e.g., processing unit 120) and configuredto provide temperature information to the processing unit. Using thetemperature information, the processing unit 120 may adjust the one ormore signal processing characteristics. Accordingly, even if detectedenergy values detected by the detector drift due to temperaturevariation, the drift may be addressed to provide improved reliabilityand accuracy. It may be noted that the number and/or position of thetemperature sensor 460 may differ in various embodiments. For example, asingle temperature sensor 460 may be used for an entire system in someembodiments. In other embodiments, each radiation detector head assemblymay have a dedicated temperature sensor used to provided temperatureinformation used by the processing unit to adjust signal processingcharacteristics of pixels of detectors disposed on a correspondingdetector head. Accordingly, pixels of detectors on different detectorheads may be adjusted based on the particular temperature of theparticular detector head on which they are disposed. Temperature sensorsin various embodiments may be used to sense temperature of airsurrounding a detector, temperature of air in a cooling flow,temperature of air in an exhaust flow, and/or temperature of detectorelectronics (e.g., using a thermistor).

FIG. 5 provides a sectional schematic view of a radiation detector headassembly 500 in accordance with various embodiments. One or more aspectsof the radiation detector head assembly 500 may be employed inconnection with one or more of the radiation detector head assemblies115 of the example discussed in connection with FIG. 1. Additionaldetails of example radiation detector head assemblies may be found atU.S. patent application Ser. No. 14/671,039, “Reduced AirborneContamination Detector Heads,” filed Mar. 27, 2015, the subject matterof which is hereby incorporated in its entirety. It may be noted thatthe radiation detector head assembly 500 may be utilized in connectionwith medical imaging (e.g., nuclear medicine (NM) imaging, positronemission tomography (PET), single photon emission computed tomography(SPECT), or the like). For example, the radiation detector head assembly500 may be a portion of an imaging system configured to image an object502 (or a portion thereof). The object 502, for example, may be a humanpatient. In the illustrated embodiment, the radiation detector headassembly 500 includes an arm 513 that may adjustably couple theradiation detector head assembly 500 to a gantry (not shown in FIG. 5;see FIG. 1 for an example of a gantry) of an imaging system. Theradiation detector head assembly 500 in various embodiments is one of agroup of assemblies that each define smaller individual fields of viewthat may be combined to provide a larger, combined field of view of anobject being imaged. For example, the radiation detector head assembly500 may be generally cylindrically shaped with a diameter of about 2.5inches and a length of about 14 inches.

In the illustrated embodiment, the depicted radiation detector headassembly 500 includes a detector housing 510 and a rotor assembly 520.The rotor assembly 520 is disposed within the detector housing 510 andis configured to be rotated in a rotational direction 505 about an axis.Rotation of the rotor assembly 520 may be performed to orient a detectorwith the rotor assembly in a desired orientation with respect to theobject 502 being imaged.

As seen in FIG. 5, the depicted detector housing 510 defines a cavity512 therein, with the rotor assembly 520 disposed within the cavity 512.The depicted detector housing 512 includes a detector cover 516 (withinwhich the cavity 512 is defined) and an arm cover 514 for an arm 513used to articulate the radiation detector assembly 510 relative to agantry (not shown in FIG. 5) or other structure to which the radiationdetector assembly 500 is mounted via the arm 513. All or a portion ofthe detector housing 510 may be made from a light, strong material thatis generally transparent to radiation emitted from an object beingimaged, such as carbon fiber. All or a portion of the detector housing510 may include a metal lining or other structure configured to address,reduce, or eliminate electromagnetic interference (EMI).

The depicted rotor assembly 520 includes a detector unit 530, acollimator 540, a body 550, and a sealing member 542. Other arrangementsinclude additional or alternative components may be employed in variousembodiments. Generally, the detector unit 530 is configured to detectradiation emitted from the object 502 (e.g., a human patient). Thecollimator 540 is interposed between the detector unit 530 and theobject 502, and is configured to control angles at which radiation isallowed to pass to the detector unit 530 from the object 502 in animaging direction 504. For example, the collimator 540 in someembodiments includes an array of tubes having small diameter holesconfigured to allow passage of photons only in a generally normaldirection to a detector surface of the detector unit 530. The detectorunit 530 includes an absorption member 532 and associated processingcircuitry 534. Generally, the absorption member 532 is configured toreceive radiation passing through the collimator 540 and to generateelectronic signals, in conjunction with the processing circuitry 534, inresponse to radiation received and/or absorbed by the absorption member532. The absorption member 532 may be formed of a semiconductormaterial, such as Cadmium Zinc Telluride (CdZnTe), often referred to asCZT, Cadmium Telluride (CdTe), or Silicon (Si), among others. In theillustrated embodiment, the body 550 is configured as, and may also beunderstood as, a radiation shielding unit. For example, the body 550partially surrounds the detector unit 530, and is configured of amaterial (e.g., Lead or Tungsten, among others) that blocks, limits,inhibits, and/or prevents the passage of radiation emitted from theobject 502 therethrough. An opening 552 is defined by the body 550 andgenerally oriented in the imaging direction 504 allowing the passage ofradiation emitted from the object 502 to pass on to the collimator 540and the detector unit 530. Generally, in the illustrated embodiment, thebody 550 acts to block radiation from entering the absorption member 532from any orientation or direction other than via the collimator 540.

It may be noted that, in use, the processing circuitry 534 may generatean amount of heat that can potentially affect performance of thedetector unit 530. Accordingly, air (e.g., from the cooling unit 130)may be directed over the rotor assembly 520 including the detector unit530 to cool the detector unit 530, to provide temperature stabilizationto the detector unit 530, and to prevent or inhibit loss of performancedue to heating of the detector unit 530. In the illustrated embodiment,the body 550 (within which the collimator 540 and detector unit 530 aredisposed) is spaced at a distance from an interior surface of thedetector housing 510, thereby defining a passageway 554. The passageway554 extends circumferentially around the rotor assembly 520 (e.g.,around the body 150) and also extends axially or along the length of therotor assembly 520 and body 550. The passageway 554 in variousembodiments is in fluid communication with a cooling manifold (e.g.,manifold 140) and receives cooling air via the cooling manifold from acooling unit (e.g., cooling unit 130). The passageway 554 allows for thepassage of air (e.g., axially) over the body 550 as well as providing aclearance for rotational movement of the rotor assembly 520 with respectto the detector housing 510. For example, air may be passed over therotor assembly 520 axially (e.g., in a direction along the length oraxis of the rotor assembly 520, or into and/or out of the page of FIG.5) and/or transversely (in a direction transverse to the axis such asclockwise or counterclockwise around a cross-section of the rotorassembly 120).

As seen in FIG. 5, the body 550 partially surrounds the detector unit530, and includes the opening 552 to allow the passage of radiationemitted from the object 502 to pass on to the collimator 540 and thedetector unit 530. Generally, the body 550 acts to block radiation fromentering the absorption member 532 from any orientation or directionother than via the collimator 540. In the illustrated embodiment, thebody 550 comprises a shielding member 556 that is surrounded by a casing558. For example, the shielding member 556 may be formed of a radiationblocking material such as Lead or Tungsten, while the casing 558 may beformed of a heat conducting material such as Aluminum. Aluminum providesfor conduction of heat away from the center of the rotor assembly 510and heat exchange with cooling air passing through the passageway 554,while also being relatively lightweight and providing sufficientstructural strength for the rotor assembly 520 to maintain its shapeduring rotation. In the illustrated embodiment, the casing 558completely surrounds the shielding member 556, with the shielding membercompletely contained within an interior of the casing 558.

In the illustrated example of FIG. 5, the casing 558 of the body 550includes fins 560 formed along an exterior surface 559 of the casing.The fins 560 may extend along all of the length of the body 550 or aportion thereof. The depicted fins 560 define openings extending intothe body 550, allowing for increased surface area for improved heatexchange between the casing 558 and a cooling air flow while stillallowing a generally circular cross-section for the rotor assembly 520for interference free rotation within the detector housing 510 withoutrequiring an overly large gap between the rotor assembly 520 and thedetector housing 510. In the example of FIG. 5, the fins 560 extendaxially along an exterior of the rotor assembly 510, with the depictedfins 560 extending axially along the exterior surface 559 of the casing558.

It may be noted that in the embodiment depicted in FIG. 5, a passagewayproviding cooling airflow is provided directly around the rotorassembly. Alternatively, in various embodiments, a passageway providinga cooling airflow to a rotor assembly may be enclosed from the rotorassembly, and be utilized for heat exchange with a second passagewaysurrounding the rotor assembly.

As discussed herein, disposed cooling air flow may be passed axially orover the length of a radiation detector head assembly. FIG. 6 shows aside view of a radiation detector head assembly 600, including a motorfor rotating the rotor assembly within the housing, which may also bereferred to as pivoting the radiation detector head assembly, formed inaccordance with various embodiments. As seen in FIG. 6, the depictedradiation detector head assembly 600 includes a motor 610, a pivot belt612, a slip-ring 614, electronics module 616, a rotor 618, a stator 620,a collimator 622, and an air duct 624. A cover or housing for theradiation detector head assembly 600 has been removed for improvedclarity and ease of illustration. As also seen in FIG. 6, a length Lextends along the radiation detector head assembly from a first end 680to a second end 690. Cooling air may be provided to the radiationdetector head assembly 600 initially at the first end 680 (e.g., via anintake from a cooling manifold such as manifold 140), with the airbecoming heated as the air passes along the length L to the second end690.

The motor 610 (e.g., an electric motor) may be controlled by aprocessing unit of an imaging system to rotate the rotor 618 (which mayinclude one or more aspects of rotor assemblies discussed herein). Themotor 610 is mounted to the stator 620, and is coupled to the rotor 618via the pivot belt 612. The slip-ring 614 allows for electricalcommunication between the electronics module 616 (which rotates with therotor 618) and electronics mounted to the stator 620 or other structurethat does not rotate with the rotor 618. In some embodiments, the rotor618 may rotate over a range of; for example, about 210 degrees toprovide flexibility in orienting a detector of the radiation detectorhead assembly 600. The air duct 624 is in fluid communication with apassageway surrounding at least a portion of the rotor 618 to providefor heat removal from the rotor 618 (e.g., using air from the coolingunit 130). Additional discussion regarding example system includingradiation detector head assemblies may be found in U.S. patentapplication Ser. No. 14/016,939, filed Sep. 3, 2013, entitled “MethodsAnd Systems For Controlling Movement Of Detectors Having MultipleDetector Heads,” which is hereby incorporated by reference in itsentirety.

As discussed above, fins may be used to improve heat transfer between aradiation detector head assembly (e.g., radiation detector head assembly115) and a cooling flow of air. It may be noted that in variousembodiments, the fins may extend from an exterior surface of a casing ofa rotor assembly, with the fins configured to have variable heattransfer capability along a length of the rotor assembly. For example,where cooling air initially encounters the radiation detector headassembly at a first end and is heated as it travels toward a second end,the detector units of the detector head assembly may have differenttemperatures along the length, resulting in potentially inconsistentperformance. Accordingly, the heat transfer capabilities of the fins maybe relatively reduced at the first and relatively increased toward thesecond end, to provide for more even heat transfer along the length andaccordingly more consistent temperature along the length.

FIG. 7 depicts a side view of fins that may be used in accordance withvarious embodiments. As seen in FIG. 7, a rotor assembly 700 includes afin 710 (plural fins may be distributed about a portion of a casing;however only one fin 710 is shown in FIG. 7 for case and clarity ofillustration) that extends along a length L of the rotor assembly 700from a first end 702 toward a second end 704. In the illustratedembodiments, cooling air is received initially proximate the first end702, travels along the length L toward the second and, becoming heated(by removing heat from the rotor assembly 700) as it travels toward thesecond end 704. Accordingly, detector units positioned proximate thesecond end 704 tend to be at a higher temperature than those proximatethe first end 702. By providing for increased heat transfer proximatethe second end 704 and/or reduced heat transfer proximate the first end702, more consistent or uniform temperature may be provided to thevarious detectors of the rotor assembly 700 disposed at differentposition along the length L.

In the example depicted in FIG. 7, variability of heat transfercapability is provided via variability in height of fins 710 along thelength L of the rotor assembly 700. As seen in FIG. 7, the fin 710extends from an exterior surface 706 of a casing 708 of the rotorassembly 700. The fin 710 has a variable height H that is smallerproximate the first end 702 (where a cooling air flow has a relativelylower temperature), with the variable height H larger proximate thesecond end 704 (where the cooling air flow has a relatively highertemperature). Accordingly, the fin 710 has greater heat transfercapability proximate the second end 704 relative to the first end 702 toprovide for a more consistent or uniform temperature along the length L.

Alternatively or additionally, fins may have differing fin lengths,wherein the number of fins (e.g., the number of fins at a given positionalong the length of the rotor assembly) varies along the length of therotor assembly. FIG. 8 depicts an overhead view of another example offins that may be used in various embodiments. As seen in FIG. 8, a rotorassembly 800 includes fins 810 that extend along a length L of the rotorassembly 800 from a first end 802 toward a second end 804. In theillustrated embodiments, cooling air is received initially proximate thefirst end 802, travels along the length L toward the second end,becoming heated (by removing heat from the rotor assembly 800) as ittravels toward the second end 804. Accordingly, detector unitspositioned proximate the second end 804 tend to be at a highertemperature than those proximate the first end 802. By providing forincreased heat transfer proximate the second end 804 and/or reduced heattransfer proximate the first end 802, more consistent or uniformtemperature may be provided to the various detectors of the rotorassembly 800 disposed at different position along the length L.

In the example depicted in FIG. 8, variability of heat transfercapability is provided via variability in the number of fins along thelength L of the rotor assembly 800. The fins 810 extend from an exteriorsurface 806 of a casing 808 of the rotor assembly 800. As seen in FIG.8, the fins 810 include a first group 820 having a first fin length 822that extends along all or most of the length L; a second group 830having a second fin length 832 that is less than the first fin length822; and a third group 840 having a third fin length 842 that is lessthan the second fin length 832. The groups of fins are arranged suchthat the shorter fins are disposed proximate the second end 804.Accordingly, positions along the length L proximate the second end 804tend to have more fins than positions along the length L proximate thefirst end 804. For example, 2 fins are present at or near the first end802 while six fins are present at or near the second end 804.Accordingly, the fins 810 provide greater heat transfer capabilityproximate the second end 804 relative to the first end 802 to providefor a more consistent or uniform temperature along the length L.

Alternatively or additionally, fins may have a variable conductivityalong the length of the rotor assembly. FIG. 9 provides a side view ofanother example of a fin that may be used in various embodiments. Asseen in FIG. 9, a rotor assembly 900 includes a fin 910 (plural fins maybe distributed about a portion of a casing; however only one fin 910 isshown in FIG. 9 for case and clarity of illustration) that extends alonga length L of the rotor assembly 900 from a first end 902 toward asecond end 904. In the illustrated embodiments, cooling air is receivedinitially proximate the first end 902, travels along the length L towardthe second end, becoming heated (by removing heat from the rotorassembly 900) as it travels toward the second end 904. Accordingly,detector units positioned proximate the second end 904 tend to be at ahigher temperature than those proximate the first end 902. By providingfor increased heat transfer proximate the second end 904 and/or reducedheat transfer proximate the first end 902, more consistent or uniformtemperature may be provided to the various detectors of the rotorassembly 900 disposed at different position along the length L.

In the example depicted in FIG. 9, variability of heat transfercapability is provided via variability in thermal conductivity of fins910 along the length L of the rotor assembly 900. As seen in FIG. 9, thefin 910 extends from an exterior surface 906 of a casing 908 of therotor assembly 900. The fin 910 has a variable thermal conductivity thatis lower proximate the first end 902 (where a cooling air flow has arelatively lower temperature), and that is higher proximate the secondend 804 (where the cooling air flow has a relatively highertemperature). The variable conductivity in the illustrated embodiment isprovided by the use of different materials to construct the fin 910. Inthe illustrated embodiment, the fin 910 includes a first portion 912 ofa first material having a relatively lower thermal conductivity, and asecond portion 914 of a second material having a relatively higherthermal conductivity. The proportion of the first material comprisingthe fin 910 to the second material becomes lower along the length L asdistance from the first end 902 increases (and, similarly, theproportion of the second material comprising the fin 910 becomes higheralong the length L as distance from the first end 902 increases). Thethermal conductivity of the fin 910 accordingly increases along thelength L toward the second end 904, as the second material has a higherthermal conductivity than the first material. Accordingly, the fin 910has greater beat transfer capability proximate the second end 904relative to the first end 902 to provide for a more consistent oruniform temperature along the length L.

It may be noted that, as temperature varies (and/or for other reasons)the performance of the detectors may vary. For example, the energydetected by a detector may change as the temperature of the detector(e.g., the temperature of CZT in the detector) varies. Accordingly, invarious embodiments, additionally or alternatively to the aspectsdiscussed above, for example, in connection with maintaining temperatureproximate a detector within a desired range, potential variance ofdetector performance may also be addressed. As performance may vary on aper pixel basis, in various embodiments signals from a detector areanalyzed on a per pixel basis. For example, each pixel may be calibratedso that information from each pixel is addressed with individuallytailored signal processing characteristics for the particular pixel. Forexample, a corresponding window and threshold may be used to read andcount events for each pixel, with at least one of the window orthreshold tailored for the individual pixel. Further still, as discussedbelow, the at least one of the window or threshold for individual pixelsmay be adjusted during imaging or over another time period (e.g., toaddress changes in detector performance over time and/or to addresschanges in temperature).

FIG. 10 depicts a schematic view of an example pixelated detector 190formed in accordance with various embodiments. One or more pixelateddetectors 190 may be used for example, to provide detectors for a givenradiation detector head assembly 115. As seen in FIG. 10, the pixelateddetector 190 includes four pixels, 192 a, 192 b, 192 c, 192 d. It may benoted that only four pixels are shown in FIG. 10 for ease and clarity ofdepiction; however, more pixels are utilized in various embodiments. Forexample, in some embodiments the pixelated detector 190 may include, forexample, an array of 64×64 pixels. In some embodiments, each detectorincludes an array of abutted detector modules, wherein each detectormodule comprises an array of 16×16 pixels. Further, in some exemplaryembodiments of the invention, each detector includes a 2D array ofabutted detector modules. For example, a small Field Of View (FOV)detector may have an array of 4×5 modules and a large FOV detector mayhave an array of 10×14 modules. In some embodiments, each detectorcomprises a 1D array of abutted detector modules, for example an arrayof 1×7 modules. As seen in FIG. 10, each of the pixels is independentlycommunicatively coupled to the processing unit 120 (e.g., via adedicated channel). Accordingly, signals or information received fromeach pixel may be processed individually by the processing unit 120.

In various embodiments, signal processing characteristics used togenerate event counts from information provided by the pixels may beindividually tailored on a per pixel basis. FIG. 11 illustrates anexample signal (or spectrum) 1100 using information provided by a pixel.The illustrated example represents use of a Tc99m radioactive sourcehaving a single a single energy peak at 140 KeV. The signal 1100 isconfigured as a plot of count density (counts per KeV). Thus, for agiven pixel, all detected events may be provided to the processing unitand be described by the signal 1100. As seen in FIG. 11, the signal 1100includes a leading edge 1112 that leads to a peak 1114. At energy levelshigher than the peak 1114, the number of counts reduces at a trailingportion 1116. An energy “tail” 1199 is caused by a combination ofeffects, including the following: 1) Compton scattering of radiationwithin the source, a casing of the source, and structures within thedetector (e.g., covers). This effect may be estimated, simulated ormeasured. 2) Detector incomplete charge collection and otherdeficiencies. 3) Charge sharing between two adjacent pixels or Comptonscattering within the detector crystal. The charge sharing effect, whichcauses the signal to be divided between two adjacent pixels, may becorrected as detailed for example in United States Patent ApplicationPublication No. 2016/0169737 entitled “SYSTEMS AND METHODS FOR SORTINGAND SUMMING SIGNALS FROM AN IMAGING DETECTOR,” which is incorporatedherein by reference in its entirety. Without the tail 1199, the spectrumwould appear as a single, almost symmetric peak continuing along thedashed line 1198. Such a peak shape may be observed in traditional NaIdetectors.

Various signal processing characteristics may be used to determine whichportion of the signal 1100 (or information provided by a pixel) is usedto provide a count that may be used to reconstruct an image (e.g., inconjunction with counts provided by other pixels and/or otherdetectors). As seen in FIG. 11, a window 1120 includes a lower boundary1122 and an upper boundary 1124 defining a corresponding width 1126. Thepeak 1114 is disposed within the window 1120. Generally, counts withinthe window 1120 may be considered as events that are counted for imagereconstruction, with counts outside of the window 1120 discarded. Thewindow 1120 in various embodiments may be asymmetric, with the peak 1114not located at the center of the window 1120. With a single peakisotope, the location of the upper energy window boundary 1124 may berelatively unimportant, as long as it is located at an energy level highenough to avoid rejection of a significant proportion of events belongto peak 1114; however, when a multi-peak isotope is used, or amulti-isotope image is acquired, the tail of the higher peak may fallwithin the acceptance window of the lower peak, where it may createfalse events which may cause image noise, image distortion, and/rartifacts. Accordingly, in such cases, it is desirable to maintain thehigh energy window boundary 1124 at the lowest energy possible, even ifsacrificing a small percentage (for example 1%) of the events in thepeak. Generally, in various embodiments, the upper energy windowboundary 1124 may be set such that the count density of the peak iscomparable to the count density of the tail of all other higher peaks.This position somewhat depends on scattering in the patient, but to alarge degree it depends on the shape of the leading edge of the peak.The optimal location of the upper energy window boundary 1124 depends onthe characteristics of the pixel, and accordingly it is beneficial totailor it for each pixel individually.

The optimal location of the lower energy window boundary 1122 may alsodepend on the characteristics of the pixel (and to some degree on thescatter in the patient), and accordingly it is beneficial to tailor itfor each pixel individually as well. Generally, in various embodiments,the lower energy window boundary 1122 may be set such that the countdensity of the peak is comparable to the count density of the tail. Oneway to set the lower energy window boundary 1122 is to estimate theenergy where the tailing edge 1198 of the peak reaches a predeterminedlow value (e.g. 10%) compared to its highest level. Alternatively,another example way to set the lower energy window boundary 1122 is toestimate the energy of the lower energy window boundary 1122 that causesthe total counts within the energy window to be a preset percentage A(e.g. A=95%) of the counts in an energy window set at 90% of the peakenergy. This effectively sets the relative sensitivity of the pixel at95% of the sensitivity used in the prior art cameras where the lowerenergy window boundary is set at peak energy −10% and higher energywindow boundary is set at peak energy +10% (e.g., 126 to 154 KeV for theTc99m isotope having a peak at 140 KeV). Such measurements arepreferably done with minimal scattering and tail and thus require aradioactive source with minimal scattering. As discussed in connectionwith FIG. 17, however, such sources are not readily available.Specifically, it is difficult to produce such a source for use with acollimator installed, as a thin flood is required.

Once the lower energy window boundary 1122 and higher energy windowboundary 1124 are determined for a specific pixel and a specificisotope, the lower energy window boundary 1122 and higher energy windowboundary 1124 may be scaled for other isotopes by a simple shift inenergy. For example, for an adjustment to a 140 KeV source, if aspecific pixel has a lower energy window boundary 1122 at 116 KeV andhigher energy window boundary 1124 at 125.5 KeV (e.g., for cobalt (122KeV−5%+3%)), boundaries for the given pixel may be set by adding 18 KeVto each boundary to account for the difference of 18 KeV (140−122=18)between the locations of the two peaks. Optionally, each peak may beexperimentally calibrated separately. Further optionally, some peaks maybe experimentally calibrated separately, and other peaks calibrated byinterpolation or extrapolation using the results of peaks experimentallycalibrated. It may be noted that, generally, peaks with higher energiestend to have narrower peaks due to smaller relative statistical andelectronic noise.

It may be noted that various embodiments disclosed herein usesubstantially narrower energy windows than prior approaches (at leastfor the majority of the pixels). As a consequence, the stability of thecalibration is relatively more consequential, as a shift of the peak maytend to cause loss of events that may fall outside the narrower energywindow. Hence, temperature stabilization is relatively more beneficialthan for cameras using relatively wide windows (+/−10%).

It may be noted that, at relatively low energy levels, noise may providea relatively high number of counts that may overwhelm the processingcapability of a system if each of the low energy counts wereindividually recorded and included, for example, as part of signal 1100.Accordingly, a threshold is set. Events having an energy below thethreshold are not recorded or further processed, while events having anenergy satisfying the threshold may be recorded and analyzed todetermine if they fall within the window 1120 and are to be counted(e.g., for use in image reconstruction). In some embodiments, eventswithin the window 1120 may be counted as events for the particularpixel, while events having an energy lower than the energy level of thelower boundary 1122 of the window 1120 may be considered in conjunctionwith information from one or more neighboring pixels to determine ifthere are charge sharing events with one or more neighbors. Variousembodiments set the threshold at a lowest possible or practical valuefor each pixel individually to allow improved counting of low energysplit or shared events (events shared between pixels) while avoidingrejection of an undue amount of pixels.

For example, in the illustrated embodiment, two low energy sections of asignal are shown—namely a first low energy section 1160 that correspondsto the low energy portion of a relatively lower noise level pixel, and asecond lower energy section 1170 of a more noisy pixel. In the absenceof a source, the low energy noise 1160 and 1170 would continue along thedashed lines 1160′ and 1170′ respectively as seen in FIG. 11. In theillustrated example, desired detector performance and processingcapability may be satisfied by keeping a maximum number of counts forthe low energy portion of the signal, for example, at 7000 counts (e.g.,7000 counts per a predetermined time period, such as 7000 counts persecond). Accordingly, a threshold 1130 for a pixel having the first lowenergy section 1160 may be set at about 25 KeV. However, the second lowenergy section 1170 has substantially more than 7000 counts at about 25KeV. To keep the second low energy section 1170 within a more practicallimit, a threshold 1132 for a second pixel corresponding to the secondlow energy is set at about 50 KeV. Thus, the maximum number of lowenergy events may be detected for each pixel while keeping the totalnumber of counts within practical levels, and not rejecting an undulylarge number of pixels, which would adversely affect manufacturing yieldand/or cost. For split event correction (e.g., such as seen in U.S.Patent Application Publication No. 20160169737) to function aseffectively as possible, both parts of the split event have to bedetected. That is, both parts of the split event in two adjacent pixelsmust be above the threshold of the pixel in which the part of the splitevent is detected. Otherwise, at least one of the parts of the splitevent would not be detected, and the event would not be recovered. Forsplit event correction to work efficiently, the threshold should be setas low as possible in each pixel according to its noise level, withoutoverwhelming the count rate capabilities. It may be noted that withmodern computers very high rates may be achieved, for example ifparallel processing and data channels are used. The maximum rate perpixel may be estimated by noting the lowest bottleneck in the data rate,and dividing it by the number of pixels. It may be noted that,surprisingly, the number of “false” (random noise) events may be much(even orders of magnitude) higher than the number of events in the peakduring clinical imaging without negatively affecting the image quality.This is because such noise events may be at an energy well below the lowenergy boundary 1122 of the energy window 1120.

It may be noted that the graph seen in FIG. 11 is plotted after energycorrection (e.g., after the energy is corrected within the processingunit 1050 according to the energy-correction parameters of each pixel).In some embodiments, to correct the energy, a linear correction may beperformed, with the energy of an event related to the signal using thefollowing correction function: Energy=(signal−offset)*gain, wherein thegain and the offset are specific to each pixel (in some embodiments, aquadratic function may be used). However, the thresholding may be doneon the uncorrected signal within the module. Accordingly, setting asingle uniform value for the threshold for all pixels may cause eachpixel to have a different (and somewhat unpredictable) threshold interms of real (corrected) event energy.

This is yet another example of a benefit of setting the thresholdseparately for each pixel. In some embodiments, the relation between thethreshold setting value and the actual corrected energy threshold may bedetermined for each pixel. The threshold setting value for a desiredcorrected energy threshold may then be set for each pixel. Measuring therelation between the threshold setting value and the actual correctedenergy threshold may be determined for each pixel by exposing thedetector to a source of continuous spectrum, measuring the count densitygraph, and optionally repeating the measurement at one or more thresholdsetting values. A source of continuous spectrum may be readily obtainedby placing an object with high scattering properties (e.g. a volume ofwater, or even a few stacks of paper or plastic sheets) between thesource and the detector.

FIG. 15 illustrates a flowchart of a method 1500. The operations of FIG.15 may be implemented by one or more processors executing programinstructions stored in memory. The method 1500, for example, may employstructures or aspects of various embodiments (e.g., systems and/ormethods) discussed herein. In various embodiments, certain steps (oroperations) may be omitted or added, certain steps may be combined,certain steps may be performed simultaneously, certain steps may beperformed concurrently, certain steps may be split into multiple steps,certain steps may be performed in a different order, or certain steps orseries of steps may be re-performed in an iterative fashion. In variousembodiments, portions, aspects, and/or variations of the method 1500 maybe used as one or more algorithms to direct hardware to perform one ormore operations described herein. It should be noted, other methods maybe used, in accordance with embodiments herein.

At 1502, a pixel of pixelated detector is activated. The pixel, forexample, may not be exposed to a source of radiation, and events fromthe pixel may be read. With no radiation source, the events read ordetected may be understood as noise. In practice, much of the noiseencountered resides at lower energy levels (e.g., energy levelssubstantially lower than peak energy levels encountered during medicalimaging).

At 1504, counts are determined. For example, the number of countsdetected by the detector may be counted and analyzed on a per time basis(e.g., counts per second). At 1506, a threshold is determined. In thedepicted embodiment, the threshold is determined such that a maximumnumber of counts is not exceeded. At 1508, the threshold for the pixelis set at the level determined at 1506. The process may be repeated foreach pixel of the detector, with an individual threshold for each pixeldetermined and implemented. In some embodiments, the threshold settingprocess may be repeated for a given pixel on a periodic basis, or may berepeated if a maximum number of counts at low energy for the pixel aredetermined at a later time (e.g., due to physical changes in the pixel)to exceed the maximum number of counts utilized at 1506.

Returning to FIG. 11, the particular location of the peak 1114 (e.g.,highest number of counts) is dependent on the isotope being detected aswell as pixel characteristics. For example, for a given isotope, thenominal peak energy value may be 140 kEv. However, some pixels mayprovide a peak at 120 kEv, some at 140 kEv, some at 160 kEv, and stillothers at other values. Further, some pixels may provide a relativelynarrow band of elevated counts around the peak, while others provide abroader band of elevated counts around the peak.

As discussed herein, signal processing characteristics (e.g., windowlocation and/or width, threshold location) may be individually tailoredon a per pixel basis. Because pixels vary from each other, in contrastto conventional approaches that, for example, use the same window andthreshold for all pixels, such tailoring provides improved accuracy andreliability, while also increasing pixel yield (e.g., reducing rejectionpixels). It may be noted that the pixel characteristics may beindividually tailored as part of an initial (and/or periodicallyperformed) calibration process and/or as part of an adjustment madeduring imaging (e.g., due to variation in pixel performance due tochange in temperature).

According to previous approaches, one threshold level is set for allpixels. Such a threshold level is set such that it is well below the lowenergy boundary 1122 of the energy window 1120 used in the camera. Oncethe threshold level is set, the count rate in the absence of a radiationsource (dark rate) for all energies is measured. An upper level ofallowed dark count rate is set at much lower than the rate anticipatedduring clinical imaging, for example less than a few counts per minuteor even less than one count per minute. Each pixel having a dark countrate higher than the allowed dark count rate is marked as “defective”and is turned off. However, the image quality degrades with the numberof defective pixels which do not contribute to the image data. If morethan a preset number of pixels (e.g. 3) are defective for a givenmodule, the module is marked as defective and is replaced. Suchreplacement of modules and/or deactivation of pixels adversely affectsimage quality and/or manufacturing cost (e.g., due to reduced yieldcaused by rejected modules). Various embodiments disclosed herein,however, change the way defective pixels are defined. According variousembodiments, isotope-dependent effective dark count rate is defined asthe number of counts per second in the energy window defined in a pixelfor the isotope in use. A pixel is deemed defective if theisotope-dependent effective dark count rate is higher than a presetfraction (e.g. 5%) of the rate anticipated within the energy window in agiven clinical imaging session. Accordingly, pixels that are considered“defective” for a low energy isotope may be useful for imaging highenergy isotopes. Also, pixels that are considered “defective” for a lowrate imaging application may be useful for imaging a high rate imagingapplications.

For example, the processing unit 120 may be configured to set thethreshold for each pixel based on a processing capability. The settingof the threshold may be performed as part of an initial set-upcalibration, or as part of a periodically performed calibration toaddress any changes in detector performance. Each pixel's threshold maybe adjusted to provide a total number of recorded or analyzed countsbased on the processing capability of the processing unit 120, forexample. Pixels that experience more noise at lower energy levels mayhave their thresholds set relatively high, while pixels that experienceless noise at lower energy levels may have their thresholds setrelatively lower. Accordingly, noisy pixels may be provided with higherthresholds to reduce noise while still allowing a noisy pixel to be usedinstead of being rejected or ignored, while less noisy pixels may beprovided with a lower threshold, allowing reading of counts at lowerenergy levels that may be used to count split or shared charges.

The threshold for each pixel may be determined based on the signalproduced by the particular pixel along with an overall system processingcapability. By way of example, for a system that can process X totalcounts over a given time period, and that has Y pixels, the number ofcounts over that time period for a given pixel may be defined as AllowedCounts=X/(Y*Z), where Z is a safety factor. For example, using a safetyfactor of 2 helps limit the total number of possible counts to half ofthe system capability. The threshold for each pixel may then beindividually set to provide, over the pertinent time period, the AllowedCounts determined above. The setting of the threshold may be performedas part of an initial set-up calibration, or as part of a periodicallyperformed calibration to address any changes in detector performance.

As another example, the processing unit 120 may be configured to set thewindow for each pixel based on characteristics of the pixel. Thelocation of the upper and lower boundaries and/or the width of thewindow may be set based on measured or calibrated characteristics ofeach pixel. For example, a known radiation exposure (e.g., a Cobaltflood) may be exposed to the detector, with each pixel analyzed tomeasure individual pixel response to the known source.

Past approaches to the setting of windows generally set upper and lowerboundaries at energy levels that were a fixed percentage of a peak valueor expected peak values (e.g., a lower boundary at an energy level −10%from the peak, and an upper boundary at an energy level +10% of a peak).Various embodiments discussed herein, in contrast, set window boundariesbased on characteristics of individual pixels to better track andrepresent actual signals and/or to provide additional flexibility formovement of a peak (e.g., due to temperature change).

By way of example, the location of the upper boundary of the window maybe set to exclude a set percentage of total counts at the highestrecorded energies. Then, the lower boundary of the window may be set toprovide a comparable sensitivity for energies below the peak. The windowwidth may be set to include a predetermined percentage of total countsobtained over the threshold. For example, in some embodiments, thewindow width may be set to include 95% of the counts above thethreshold. For instance, the upper boundary may be set to exclude thehighest 3% of counts above the threshold. Then the lower boundary may beset to exclude the lowest 2% of counts above the threshold. As anotherexample, the lower boundary may be set at distance from the peakcorresponding to the distance of the upper boundary of the peak. Thedistance from the lower boundary to the peak may be the same as thedistance from the upper boundary to the peak in examples utilizing asymmetric window, and the distance from the lower boundary to the peakmay be different from the distance from the upper boundary to the peakin examples utilizing an asymmetric window. The signal used forcalibration may be obtained by deconvolving a known pixel response froma measured signal. As another example, the upper boundary of the windowmay be set at a given percentage of the peak value (e.g., the upperboundary set where the signal has a higher energy than the peak and isat 3% of the peak number of counts). Similarly, the lower boundary ofthe window may be set at a given percentage of the peak (e.g., the lowerboundary set where the signal has a lower energy than the peak and is at33% of the peak number of counts). As discussed herein, the window maybe set to include a predetermined number of counts relative to abaseline or standard, for example as described in connection with FIG.16.

FIG. 16 illustrates a flowchart of a method 1600. The operations of FIG.16 may be implemented by one or more processors executing programinstructions stored in memory. The method 1600, for example, may employstructures or aspects of various embodiments (e.g., systems and/ormethods) discussed herein. In various embodiments, certain steps (oroperations) may be omitted or added, certain steps may be combined,certain steps may be performed simultaneously, certain steps may beperformed concurrently, certain steps may be split into multiple steps,certain steps may be performed in a different order, or certain steps orseries of steps may be re-performed in an iterative fashion. In variousembodiments, portions, aspects, and/or variations of the method 1600 maybe used as one or more algorithms to direct hardware to perform one ormore operations described herein. It should be noted, other methods maybe used, in accordance with embodiments herein.

At 1602, counts for a pixel are collected. The counts may be collectedas part of an imaging procedure, where an object to be imaged (e.g., ahuman patient) has been administered an imaging radiopharmaceutical.

At 1604, a target number of counts is determined. For example, thetarget number of counts may correspond to an area under a signal (e.g.,signal 1100) resulting from the collected counts from 1602. For example,a base number of counts (or target area under a signal curve within awindow) may be defined by determining the number of counts present whenusing a predetermined window having a predetermined shape (e.g., a lowerboundary at −10% of peak energy and an upper boundary at +10% of peakenergy). The target number of counts is then a percentage of the basenumber counts from the predetermined window (e.g., 90% of counts forpredetermined window, 95% of counts for predetermined window, 98% ofcounts for predetermined window, or 100% of counts for predeterminedwindow, among others). The window may then be set for example, toprovide the narrowest window possible that includes the target number ofcounts.

In the depicted embodiment, at 1606, the upper window is determined. Forexample, the upper window may be placed at an energy corresponding to apredetermined percentage of peak energy (e.g., 3% or 5%, among others).As another example, the upper window may be placed at an energy levelcorresponding to a number of counts that correspond to a percentage ofpeak counts (e.g., 1%, 2%, or 5%, among others).

At 1608, with the target number of counts known and the upper boundaryof the window determined, the lower boundary of the window is determinedbased on the target number of counts. For example, the lower boundary ofthe window may be determined to provide the target number of counts incooperation with the upper boundary of the window. In some embodiments,the lower boundary of the window may first be set (e.g., correspondingto a predetermined percentage of peak energy value or peak number ofcounts), and the upper boundary then determined to provide the targetnumber of counts in cooperation with the lower boundary. The processperformed in connection with FIG. 16 may be performed for each pixel,and may be re-performed on a periodic basis or on a continuous basis.

In various embodiments, the processing unit 120 may be configured toadjust a signal processing characteristic (e.g., threshold, windowsetting) for at least one pixel. The adjustment may be made, forexample, during imaging. As another example, the adjustment may be madeas part of a periodic or scheduled calibration process. In someembodiments, the adjustment may be made based on a measured externalcondition (e.g., temperature or change in temperature). In someembodiments, the adjustment may be made based on information provided bya given pixel (e.g., movement of a portion of a signal (e.g., signal1100) based on information provided by the pixel).

For example, in some embodiments, to address changes in pixelperformance, the processing unit 120 may adjust the window 1120 based ona leading edge 1112 of the signal or spectrum 1100 produced by thepixel. For instance, the leading edge 1112 may be defined as a height ata predefined fraction of the height of peak 1114 (e.g., ⅓ of the heightof the peak 1114). Then, if the energy level corresponding to thelocation of the leading edge 1112 changes over time, the position of thewindow 1120 used to process signal from the pixel may be changed acorresponding amount. For instance, the lower boundary 1122 and upperboundary 1124 may be adjusted by the same amount as the leading edge1112 has moved from a previous position. Accordingly, if the leadingedge 1112 moves to a higher energy (e.g., due to an increase intemperature), the window 1120 may be adjusted to define a higher rangeof energies. Or, if the leading edge 1112 moves to a lower energy (e.g.,due to an increase in temperature), the window 1120 may be adjusted todefine a lower range of energies. A leading or rising edge of the signalmay beneficially be used in various embodiments as the rising edge maynot be affected by scatter. The number of counts used to identify theleading edge may be selected to be higher than a number of counts thatmay be encountered due to scatter. In other embodiments, other featuresof the signal 1100 may be used (e.g., peak location) to determine anadjustment. Additionally or alternatively, in addition to windowlocation (e.g., a location of the center of the window) the width 1126of the window 1120 may be adjusted.

As another example, in some embodiments, to address changes in pixelperformance due to a measurable external condition, the window may beadjusted based on a sensed or determined external condition, such as asensed temperature. For example, each pixel, during a calibrationprocedure, may be subjected to different temperatures, with the effectof temperature on signal or information output by the pixel analyzed todetermine the impact of temperature change on signal characteristics,e.g., peak location and/or corresponding window width. Accordingly, apredetermined relationship between temperature and one or more windowfeatures (e.g., location of upper and lower boundaries) may bedetermined for each pixel. Then, during imaging, information regardingthe temperature experienced by each pixel may be provided to theprocessing unit 120. For example, a temperature sensor associated witheach pixel may sense a temperature proximate to a given pixel, providetemperature information to the processing unit 120, and the processingunit 120 may then in response adjust the window used to analyzeinformation from the given pixel an appropriate amount based on thepredetermined relationship between temperature and window features. Thepixels of the detector(s) of each individual radiation detector headassembly may be adjusted using the temperature sensed by a dedicatedtemperature sensor disposed on the particular radiation detector headassembly in some embodiments.

FIG. 12 illustrates a flowchart of a method 1200. The operations of FIG.12 may be implemented by one or more processors executing programinstructions stored in memory. The method 1200, for example, may employstructures or aspects of various embodiments (e.g., systems and/ormethods) discussed herein, such as the system 100. In variousembodiments, certain steps (or operations) may be omitted or added,certain steps may be combined, certain steps may be performedsimultaneously, certain steps may be performed concurrently, certainsteps may be split into multiple steps, certain steps may be performedin a different order, or certain steps or series of steps may bere-performed in an iterative fashion. In various embodiments, portions,aspects, and/or variations of the method 1200 may be used as one or morealgorithms to direct hardware (e.g., processing unit 120) to perform oneor more operations described herein. It should be noted, other methodsmay be used, in accordance with embodiments herein.

At 1202, an object to be imaged is positioned. The object may be a humanpatient or a portion thereof. The object in various embodiments isdisposed in the gantry of an imaging detector having plural detectorassemblies (e.g., radiation detector head assemblies 115) havingpixelated detectors.

At 1204, radiation events are acquired using the pixelated detectors. Inthe depicted embodiment, each pixel is individually read. For example,each pixel may have a separate dedicated channel coupling the pixel toone or more processing units. The impact of radiation on the detectorresults in electrical signals sent to the one or more processors toacquire the radiation events. As the radiation events are acquired, theevents may be characterized by their detected energy to provide a signalcorresponding to total number of counts plotted against energy level.Events that satisfy a threshold may be retained for further processingand/or consideration, while events that do not satisfy a threshold maynot be recorded or retained.

At 1206, with a processing unit (e.g., processing unit 120), eventsacquired by the pixelated detector are counted. The events are countedon a per pixel basis, with the results used to reconstruct an image. Forexample, the number of counts over a given time period for a given pixelmay be used to determine the appearance of a portion of an imagecorresponding to the particular pixel. Events that fall within apredefined window (e.g., a range of energies distributed about a peak inthe signal) may be counted as true events used for image reconstruction,while events that fall outside of the predefined window are discarded ornot counted as true events, and are not used for image reconstruction.(It may be noted that, in embodiments utilizing charge-sharing countingtechniques, events that fall outside of the window for neighboringpixels may be combined as appropriate and counted as a joint or sharedevent between pixels). In the illustrated embodiment, at least one ofthe threshold or the window are individually tailored for each pixel.For example, to account for variations in low energy noise in pixels(e.g., to prevent processing capabilities from being overwhelmed bylarge counts of low energy noise while still providing for the abilityto count low energy events, for example, as part of a charge-sharingcounting technique), each pixel may have an individually set (e.g., aspart of a calibration process) threshold. As another example, to accountfor variance between pixels (e.g., variances in peak location and/orbreadth or steepness of spectra or signal of counts vs. energy), thewindow (e.g., location of upper boundary, location of lower boundary)may be individually set for each window. It may be noted that pixelcharacteristics (e.g., energy level produced by radiation events) mayvary, for example due to changes in Temperature, or due to changes inthe detector over time. Accordingly, in various embodiments, signalprocessing characteristics (e.g., threshold, window) may be changed oradjusted to account for variations. In some embodiments, the changes oradjustments may be made on a per pixel basis.

In the illustrated embodiment, at 1208, at least one of the window orthreshold for at least one pixel is adjusted. The adjustment in someembodiments takes place during imaging. Alternatively or additionally,the adjustment may be made while the imaging system is not in use or notscanning a patient. For example, as part of a periodic calibration(e.g., nightly, weekly, monthly), information from one or more scans maybe used to track trends in the signal produced by a pixel (e.g., amountof low level noise, position of rising or leading edge of signal) and tomake appropriate adjustments. Signal processing characteristics for eachpixel may be adjusted individually in various embodiments. As anotherexample, signal processing characteristics may be adjusted based onapplication type (e.g., high sensitivity vs. high resolution), organtype, and/or patient size, among others. For example, a first window maybe defined for high sensitivity applications where sensitivity isrelatively more important, and a second window defined for highresolution where resolution is relatively more important.

It my be noted that using a relatively narrow energy is advantageous forrejecting scattered radiation. However, the narrower the energy window,the lower the sensitivity, since some direct radiation may be rejectedas well. Further, dome diagnostic images are more susceptible toscattered radiation than others. For example, when attempting to located“voids” or “cold spots” in an organ, such as non-viable or unhealthysections in an organ that retains the radiopharmaceuticals, scatteredradiation from surrounding tissue may be scattered into the location ofthe image, masking the lower activity abnormality. In such cases, use ofnarrow energy windows helps provide better contrast and a superiorimage. On the other hand, when attempting to locate small peak and aweak “hot spot,” such as an active malignant metatastic lesion in abackground of low radiation level, use of a somewhat wider window may beuseful. Once an energy spectrum of each pixel is measured and retained,new energy windows may be defined without the need to repeat the dataacquisition used for generating the energy spectrum. Accordingly, invarious embodiments, the energy window (and/or other pixel operationparameters such as the threshold) are selected, varied, and/or adjustedbased on the type of the diagnostic imaging procedure.

It may be noted that the threshold and/or window may be adjusted basedon observed signal characteristics (e.g., trends or changes in signalsproduces by a given pixel) and/or based on measured external conditions.For example, in the illustrated embodiment, at 1210, the window isadjusted based on a leading edge of a corresponding spectrum or signal(e.g., signal 1100) produced by a given pixel. The adjustment may bemade individually for all pixels of an imaging system or a portionthereof. As another example, in the illustrated embodiment, at 1212, thewindow is adjusted based on a sensed temperature. For example, eachpixel may be calibrated to obtain a predefined relationship defining thepixel's response to temperature change. As the temperature is observedto change (e.g., via a temperature sensor associated with the pixel),the window may be adjusted based on the predefined relationship.Additionally or alternatively, the threshold may be adjusted based ontemperature change.

When a patient is imaged, a large portion of the radiation undergoessmall angle Compton scattering, and the count density graph may appeargenerally similarly to dashed line 1197 of FIG. 11. However, a leadingedge of peak 1114 may only be slightly affected, and may be used forverification of the position of the peak. Such a determination of peakposition requires a large number of counts, and may be done aftersubstantial acquisition time. In various embodiments, events are storedduring diagnostic acquisition in a list of events each associated with(at least) its corresponding pixel index and energy. After enough eventshave been accumulated—during the acquisition, after the acquisitionended, or even after few acquisitions—the position of the leading edgemay be determined. If the peak position has shifted enough to cause adegradation of the image, the energy windows may be adjusted and theevents in the list re-analyzed according to the new energy windows.Optionally, a calibration source may be used periodically, for exampleat the end of the day to verify that the calibration is sufficientlyaccurate. If the calibration is not sufficiently accurate, the energywindows may be adjusted, and the events in the list re-analyzedaccording to the new energy windows.

It may be noted that even when imaging a patient injected with amulti-peak isotope, or multiple isotopes, the leading edge of the peakwith the highest energy may be easily analyzed as it is unaffected bythe other peaks. Optionally, position of the leading edges of lowerenergy peaks may also be accurately determined.

At 1213, it is determined if the scan is to continue, or if more eventsare to be acquired. If so, the method 1200 may return to 1204 to acquireadditional events using the adjustments of 1208. If no more imaginginformation is to be acquired, the method 1200 proceeds to 1214.

At 1214, an image is reconstructed. For example, one or more processors(e.g., processing unit 120) may utilize the counts determined per pixelto reconstruct an image. For example, the appearance (e.g., the shade orcolor) of a portion of an image corresponding to a given pixel may bedetermined using the true events counted for that particular pixel.

It may be noted that, as part of a calibration or re-calibrationprocedure, knowledge of the true energy response of a pixel may beutilized for qualifying the pixel and for correctly setting an energywindow for the pixel during imaging. To measure a true energy response,a pure single-peak source may be employed; however, such sources may bedifficult to obtain and/or use in the field. Cobalt, which may forexample be utilized in the field, has two peaks. In various embodiments,the energy response of the pixel may be obtained by computing adeconvolution process with a known true spectrum of the source. Withreference to FIG. 17, a measured signal 1700 (e.g., from a 2 peakcalibration source such as Cobalt) may be deconvolved to recover asingle energy source curve for calibration, using the assumption thatthe energy response function remains essentially similar for differentpeak energies, with the response shifting with different peak energylevels. In FIG. 17, the measured signal 1700 may be understood as theresult of the convolution of a known emission of Cobalt with the energyresponse of the pixel. In FIG. 17, contributions to the measured signal1700 include the first cobalt peak 1710, the second peak 1720, firstscatter 1730 of the first peak 1710, and second scatter 1740 of thesecond peak 1720. By deconvolving the measured signal 1700 with theknown emission of the radiation source (e.g., first cobalt peak 1710,second peak 1720, first scatter 1730 of first peak 1710, and secondscatter 1740 of second scatter 1720), the energy response of the pixelmay be determined and used for calibration. One or more aspects of thecalibration may be performed according to the process discussed above inconnection with FIG. 11, wherein the result of the deconvolution is usedinstead of the measured spectrum. Generally, the contribution of thefirst peak 1710 and the second peak 1720 are well known, and thecontribution of the first scatter 1730 of the first peak 1710 and thesecond scatter 1740 of the second peak 1720 may be measured once with ahigh resolution detector (e.g. cooled Ge detector), or estimated for aspecific type of calibration source.

In Gamma cameras, the acquired image may undergo a sensitivitycorrection calibration to account for variability in the size andsensitivity of each pixel and variability of the collimator bores.According to various embodiments, sensitivity may be calibrated for theactual energy windows used. Thus, if a cobalt source is used, thedeconvolution process used for calibration may be performed before thesensitivity calibration. Similarly, if, for a specific type of imaging,the threshold is readjusted, or a specific pixel is turned off thesensitivity of said the specific pixel and its neighbors may be adjustedsince the efficiency of the split correction algorithm will be affected.Accordingly, in various embodiments, a sensitivity calibration may beadjusted based on the energy window used, without the need to repeat thedata acquisition used for generating the energy spectrum.

It may be noted that, in some embodiments, a periodic calibration oradjustment may be performed using list mode data from one or more scansat a post-processing stage, to confirm and/or update window settings. Anexample of a method including post-acquisition adjustment of windowsetting is provided by FIG. 18.

FIG. 18 illustrates a flowchart of a method 1800. The operations of FIG.18 may be implemented by one or more processors executing programinstructions stored in memory. The method 1800, for example, may employstructures or aspects of various embodiments (e.g., systems and/ormethods) discussed herein. In various embodiments, certain steps (oroperations) may be omitted or added, certain steps may be combined,certain steps may be performed simultaneously, certain steps may beperformed concurrently, certain steps may be split into multiple steps,certain steps may be performed in a different order, or certain steps orseries of steps may be re-performed in an iterative fashion. In variousembodiments, portions, aspects, and/or variations of the method 1800 maybe used as one or more algorithms to direct hardware to perform one ormore operations described herein. It should be noted, other methods maybe used, in accordance with embodiments herein.

At 1802, scanning information is acquired. The information may beacquired, for example, with a scanning system including multipledetector heads configured to detect radiation from an object (e.g., ahuman patient that has been administered a radioactive imagingpharmaceutical).

At 1804, the scan is terminated. For example, after a desired timeperiod, or after a desired number of counts have been acquired, thedetector heads may be de-activated and the object removed from thescanning system.

At 1806, at some point after the scan has been terminated, the scanninginformation is analyzed. The scanning information may be analyzed, forexample, in a list mode. Generally, the scanning information is analyzedto identify and adjust for any movement in observed energy levelscorresponding to one or more peaks of a radioactive isotope.

At 1808, a window (e.g., window 1120) for analyzing imaging data isadjusted. For example, the window may be adjusted based on a shift orchange in the rising edge or leading edge of a signal leading up to apeak. By adjusting the window at 1808, various embodiments provide afail-safe post acquisition checking of energy window position, or aback-up to ensure accurate peak tracking. The window may be adjusted ona per-pixel basis. If, for the given pixel, the peak remains within thewindow or a desired portion of the window, no adjustment need be made.However, for any pixels where the peak does not remain within the windowor desired portion of the window, the window may be adjusted to includethe peak as desired. Accordingly, changes in peak that are not detectedby a sensor or otherwise not addressed in real-time or near real-time,may still be accounted for in various embodiments. It may be noted that,for a given pixel, multiple adjustments of the window may be madecorresponding to changes of the peak during the acquisition.

At 1810, an image is reconstructed. In the depicted embodiment, theimage is reconstructed using the scanning information acquired at 1802and the window adjustment(s) determined at 1808.

The embodiments described above and illustrated by FIGS. 1-12 may beimplemented in medical imaging systems, such as, for example, SPECT,SPECT-CT, PET and PET-CT. Various methods and/or systems (and/or aspectsthereof) described herein may be implemented using a medical imagingsystem. For example, FIG. 13 is a schematic illustration of a NM imagingsystem 1000 having a plurality of imaging detector head assembliesmounted on a gantry (which may be mounted, for example, in rows, in aniris shape, or other configurations, such as a configuration in whichthe movable detector carriers 1016 are aligned radially toward thepatient-body 1010). It should be noted that the arrangement of FIG. 13is provided by way of example for illustrative purposes, and that otherarrangements (e.g., detector arrangements) may be employed in variousembodiments. In the illustrated example, a plurality of imagingdetectors 1002 are mounted to a gantry 1004. In the illustratedembodiment, the imaging detectors 1002 are configured as two separatedetector arrays 1006 and 1008 coupled to the gantry 1004 above and belowa subject 1010 (e.g., a patient), as viewed in FIG. 13. The detectorarrays 1006 and 1008 may be coupled directly to the gantry 1004, or maybe coupled via support members 1012 to the gantry 1004 to allow movementof the entire arrays 1006 and/or 1008 relative to the gantry 1004 (e.g.,transverse translating movement in the left or right direction as viewedby arrow T in FIG. 13). Additionally, each of the imaging detectors 1002includes a detector unit 1014, at least some of which are mounted to amovable detector carrier 1016 (e.g., a support arm or actuator that maybe driven by a motor to cause movement thereof) that extends from thegantry 1004. In some embodiments, the detector carriers 1016 allowmovement of the detector units 1014 towards and away from the subject1010, such as linearly. Thus, in the illustrated embodiment the detectorarrays 1006 and 1008 are mounted in parallel above and below the subject1010 and allow linear movement of the detector units 1014 in onedirection (indicated by the arrow L), illustrated as perpendicular tothe support member 1012 (that are coupled generally horizontally on thegantry 1004). However, other configurations and orientations arepossible as described herein. It should be noted that the movabledetector carrier 1016 may be any type of support that allows movement ofthe detector units 1014 relative to the support member 1012 and/organtry 1004, which in various embodiments allows the detector units 1014to move linearly towards and away from the support member 1012.

Each of the imaging detectors 1002 in various embodiments is smallerthan a conventional whole body or general purpose imaging detector. Aconventional imaging detector may be large enough to image most or allof a width of a patient's body at one time and may have a diameter or alarger dimension of approximately 50 cm or more. In contrast, each ofthe imaging detectors 1002 may include one or more detector units 1014coupled to a respective detector carrier 1016 and having dimensions offor example, 4 cm to 20 cm and may be formed of Cadmium Zinc Telluride(CZT) tiles or modules. For example, each of the detector units 1014 maybe 8×8 cm in size and be composed of a plurality of CZT pixelatedmodules (not shown). For example, each module may be 4×4 cm in size andhave 16×16=256 pixels (pixelated anodes). In some embodiments, eachdetector unit 1014 includes a plurality of modules, such as an array of1×7 modules. However, different configurations and array sizes arecontemplated including, for example, detector units 1014 having multiplerows of modules.

It should be understood that the imaging detectors 1002 may be differentsizes and/or shapes with respect to each other, such as square,rectangular, circular or other shape. An actual field of view (FOV) ofeach of the imaging detectors 1002 may be directly proportional to thesize and shape of the respective imaging detector.

The gantry 1004 may be formed with an aperture 1018 (e.g., opening orbore) therethrough as illustrated. A patient table 1020, such as apatient bed, is configured with a support mechanism (not shown) tosupport and carry the subject 1010 in one or more of a plurality ofviewing positions within the aperture 1018 and relative to the imagingdetectors 1002. Alternatively, the gantry 1004 may comprise a pluralityof gantry segments (not shown), each of which may independently move asupport member 1012 or one or more of the imaging detectors 1002.

The gantry 1004 may also be configured in other shapes, such as a “C”,“H” and “L”, for example, and may be rotatable about the subject 1010.For example, the gantry 1004 may be formed as a closed ring or circle,or as an open arc or arch which allows the subject 1010 to be easilyaccessed while imaging and facilitates loading and unloading of thesubject 1010, as well as reducing claustrophobia in some subjects 1010.

Additional imaging detectors (not shown) may be positioned to form rowsof detector arrays or an arc or ring around the subject 1010. Bypositioning multiple imaging detectors 1002 at multiple positions withrespect to the subject 1010, such as along an imaging axis (e.g., headto toe direction of the subject 1010) image data specific for a largerFOV may be acquired more quickly.

Each of the imaging detectors 1002 has a radiation detection face, whichis directed towards the subject 1010 or a region of interest within thesubject.

The collimators 1022 (and detectors) in FIG. 13 are depicted for ease ofillustration as single collimators in each detector head. Optionally,for embodiments employing one or more parallel-hole collimators,multi-bore collimators may be constructed to be registered with pixelsof the detector units 1014, which in one embodiment are CZT detectors.However, other materials may be used. Registered collimation may improvespatial resolution by forcing photons going through one bore to becollected primarily by one pixel. Additionally, registered collimationmay improve sensitivity and energy response of pixelated detectors asdetector area near the edges of a pixel or in-between two adjacentpixels may have reduced sensitivity or decreased energy resolution orother performance degradation. Having collimator septa directly abovethe edges of pixels reduces the chance of a photon impinging at thesedegraded-performance locations, without decreasing the overallprobability of a photon passing through the collimator.

A controller unit 1030 may control the movement and positioning of thepatient table 1020, imaging detectors 1002 (which may be configured asone or more arms), gantry 1004 and/or the collimators 1022 (that movewith the imaging detectors 1002 in various embodiments, being coupledthereto). A range of motion before or during an acquisition, or betweendifferent image acquisitions, is set to maintain the actual FOV of eachof the imaging detectors 1002 directed, for example, towards or “aimedat” a particular area or region of the subject 1010 or along the entiresubject 1010. The motion may be a combined or complex motion in multipledirections simultaneously, concurrently, or sequentially.

The controller unit 1030 may have a gantry motor controller 1032, tablecontroller 1034, detector controller 1036, pivot controller 1038, andcollimator controller 1040. The controllers 1030, 1032, 1034, 1036,1038, 1040 may be automatically commanded by a processing unit 1050,manually controlled by an operator, or a combination thereof. The gantrymotor controller 1032 may move the imaging detectors 1002 with respectto the subject 1010, for example, individually, in segments or subsets,or simultaneously in a fixed relationship to one another. For example,in some embodiments, the gantry controller 1032 may cause the imagingdetectors 1002 and/or support members 1012 to move relative to or rotateabout the subject 1010, which may include motion of less than or up to180 degrees (or more).

The table controller 1034 may move the patient table 1020 to positionthe subject 1010 relative to the imaging detectors 1002. The patienttable 1020 may be moved in up-down directions, in-out directions, andright-left directions, for example. The detector controller 1036 maycontrol movement of each of the imaging detectors 1002 to move togetheras a group or individually. The detector controller 1036 also maycontrol movement of the imaging detectors 1002 in some embodiments tomove closer to and farther from a surface of the subject 1010, such asby controlling translating movement of the detector carriers 1016linearly towards or away from the subject 1010 (e.g., sliding ortelescoping movement). Optionally, the detector controller 1036 maycontrol movement of the detector carriers 1016 to allow movement of thedetector array 1006 or 1008. For example, the detector controller 1036may control lateral movement of the detector carriers 1016 illustratedby the T arrow (and shown as left and right as viewed in FIG. 10). Invarious embodiments, the detector controller 1036 may control thedetector carriers 1016 or the support members 1012 to move in differentlateral directions. Detector controller 1036 may control the swivelingmotion of detectors 1002 together with their collimators 1022. In someembodiments, detectors 1002 and collimators 1022 may swivel or rotatearound an axis.

The pivot controller 1038 may control pivoting or rotating movement ofthe detector units 1014 at ends of the detector carriers 1016 and/orpivoting or rotating movement of the detector carrier 1016. For example,one or more of the detector units 1014 or detector carriers 1016 may berotated about at least one axis to view the subject 1010 from aplurality of angular orientations to acquire, for example, 3D image datain a 3D SPECT or 3D imaging mode of operation. The collimator controller1040 may adjust a position of an adjustable collimator, such as acollimator with adjustable strips (or vanes) or adjustable pinhole(s).

It should be noted that motion of one or more imaging detectors 1002 maybe in directions other than strictly axially or radially, and motions inseveral motion directions may be used in various embodiment. Therefore,the term “motion controller” may be used to indicate a collective namefor all motion controllers. It should be noted that the variouscontrollers may be combined, for example, the detector controller 1036and pivot controller 1038 may be combined to provide the differentmovements described herein.

Prior to acquiring an image of the subject 1010 or a portion of thesubject 1010, the imaging detectors 1002, gantry 1004, patient table1020 and/or collimators 1022 may be adjusted, such as to first orinitial imaging positions, as well as subsequent imaging positions. Theimaging detectors 1002 may each be positioned to image a portion of thesubject 1010. Alternatively, for example in a case of a small sizesubject 1010, one or more of the imaging detectors 1002 may not be usedto acquire data, such as the imaging detectors 1002 at ends of thedetector arrays 1006 and 1008, which as illustrated in FIG. 13 are in aretracted position away from the subject 1010. Positioning may beaccomplished manually by the operator and/or automatically, which mayinclude using, for example, image information such as other imagesacquired before the current acquisition, such as by another imagingmodality such as X-ray Computed Tomography (CT), MRI, X-Ray, PET orultrasound. In some embodiments, the additional information forpositioning, such as the other images, may be acquired by the samesystem, such as in a hybrid system (e.g., a SPECT/CT system).Additionally, the detector units 1014 may be configured to acquirenon-NM data, such as x-ray CT data. In some embodiments, amulti-modality imaging system may be provided, for example, to allowperforming NM or SPECT imaging, as well as x-ray CT imaging, which mayinclude a dual-modality or gantry design as described in more detailherein.

After the imaging detectors 1002, gantry 1004, patient table 1020,and/or collimators 1022 are positioned, one or more images, such asthree-dimensional (3D) SPECT images are acquired using one or more ofthe imaging detectors 1002, which may include using a combined motionthat reduces or minimizes spacing between detector units 1014. The imagedata acquired by each imaging detector 1002 may be combined andreconstructed into a composite image or 3D images in variousembodiments.

In one embodiment, at least one of detector arrays 1006 and/or 1008,gantry 1004, patient table 1020, and/or collimators 1022 are moved afterbeing initially positioned, which includes individual movement of one ormore of the detector units 1014 (e.g., combined lateral and pivotingmovement) together with the swiveling motion of detectors 1002. Forexample, at least one of detector arrays 1006 and/or 1008 may be movedlaterally while pivoted. Thus, in various embodiments, a plurality ofsmall sized detectors, such as the detector units 1014 may be used for3D imaging, such as when moving or sweeping the detector units 1014 incombination with other movements.

In various embodiments, a data acquisition system (DAS) 1060 receiveselectrical signal data produced by the imaging detectors 1002 andconverts this data into digital signals for subsequent processing.However, in various embodiments, digital signals are generated by theimaging detectors 1002. An image reconstruction device 1062 (which maybe a processing device or computer) and a data storage device 1064 maybe provided in addition to the processing unit 1050. It should be notedthat one or more functions related to one or more of data acquisition,motion control, data processing and image reconstruction may beaccomplished through hardware, software and/or by shared processingresources, which may be located within or near the imaging system 1000,or may be located remotely. Additionally, a user input device 1066 maybe provided to receive user inputs (e.g., control commands), as well asa display 1068 for displaying images. DAS 1060 receives the acquiredimages from detectors 1002 together with the corresponding lateral,vertical, rotational and swiveling coordinates of gantry 1004, supportmembers 1012, detector units 1014, detector carriers 1016, and detectors1002 for accurate reconstruction of an image including 3D images andtheir slices.

It should be noted that the particular arrangement of components (e.g.,the number, types, placement, or the like) of the illustratedembodiments may be modified in various alternate embodiments. Forexample, in various embodiments, different numbers of a given module orunit may be employed, a different type or types of a given module orunit may be employed, a number of modules or units (or aspects thereof)may be combined, a given module or unit may be divided into pluralmodules (or sub-modules) or units (or sub-units), one or more aspects ofone or more modules may be shared between modules, a given module orunit may be added, or a given module or unit may be omitted.

As used herein, a structure, limitation, or element that is “configuredto” perform a task or operation is particularly structurally formed,constructed, or adapted in a manner corresponding to the task oroperation. For purposes of clarity and the avoidance of doubt, an objectthat is merely capable of being modified to perform the task oroperation is not “configured to” perform the task or operation as usedherein. Instead, the use of“configured to” as used herein denotesstructural adaptations or characteristics, and denotes structuralrequirements of any structure, limitation, or element that is describedas being “configured to” perform the task or operation. For example, aprocessing unit, processor, or computer that is “configured to” performa task or operation may be understood as being particularly structuredto perform the task or operation (e.g., having one or more programs orinstructions stored thereon or used in conjunction therewith tailored orintended to perform the task or operation, and/or having an arrangementof processing circuitry tailored or intended to perform the task oroperation). For the purposes of clarity and the avoidance of doubt, ageneral purpose computer (which may become “configured to” perform thetask or operation if appropriately programmed) is not “configured to”perform a task or operation unless or until specifically programmed orstructurally modified to perform the task or operation.

As used herein, the term “computer,” “processor,” or “module” mayinclude any processor-based or microprocessor-based system includingsystems using microcontrollers, reduced instruction set computers(RISC), application specific integrated circuits (ASICs), logiccircuits, and any other circuit or processor capable of executing thefunctions described herein. The above examples are exemplary only, andare thus not intended to limit in any way the definition and/or meaningof the term “computer,” “processor,” or “module.”

The computer or processor executes a set of instructions that are storedin one or more storage elements, in order to process input data. Thestorage elements may also store data or other information as desired orneeded. The storage element may be in the form of an information sourceor a physical memory element within a processing machine.

The set of instructions may include various commands that instruct thecomputer or processor as a processing machine to perform specificoperations such as the methods and processes of the various embodimentsof the invention. The set of instructions may be in the form of asoftware program. The software may be in various forms such as systemsoftware or application software. Further, the software may be in theform of a collection of separate programs or modules, a program modulewithin a larger program or a portion of a program module. The softwarealso may include modular programming in the form of object-orientedprogramming. The processing of input data by the processing machine maybe in response to operator commands, or in response to results ofprevious processing, or in response to a request made by anotherprocessing machine.

As used herein, the terms “software” and “firmware” may include anycomputer program stored in memory for execution by a computer, includingRAM memory, ROM memory, EPROM memory, EEPROM memory, and non-volatileRAM (NVRAM) memory. The above memory types are exemplary only, and arethus not limiting as to the types of memory usable for storage of acomputer program.

It is to be understood that the above description is intended to beillustrative, and not restrictive. For example, the above-describedembodiments (and/or aspects thereof) may be used in combination witheach other. In addition, many modifications may be made to adapt aparticular situation or material to the teachings of the variousembodiments of the invention without departing from their scope. Whilethe dimensions and types of materials described herein are intended todefine the parameters of the various embodiments of the invention, theembodiments are by no means limiting and are exemplary embodiments. Manyother embodiments will be apparent to those of skill in the art uponreviewing the above description. The scope of the various embodiments ofthe invention should, therefore, be determined with reference to theappended claims, along with the full scope of equivalents to which suchclaims are entitled.

In the appended claims, the terms “including” and “in which” are used asthe plain-English equivalents of the respective terms “comprising” and“wherein.” Moreover, in the following claims, the terms “first,”“second,” and “third,” etc. are used merely as labels, and are notintended to impose numerical requirements on their objects. Further, thelimitations of the following claims are not written inmeans-plus-function format and are not intended to be interpreted basedon 35 U.S.C. § 112(f), unless and until such claim limitations expresslyuse the phrase “means for” followed by a statement of function void offurther structure.

This written description uses examples to disclose the variousembodiments of the invention, including the best mode, and also toenable any person skilled in the art to practice the various embodimentsof the invention, including making and using any devices or systems andperforming any incorporated methods. The patentable scope of the variousembodiments of the invention is defined by the claims, and may includeother examples that occur to those skilled in the art. Such otherexamples are intended to be within the scope of the claims if theexamples have structural elements that do not differ from the literallanguage of the claims, or if the examples include equivalent structuralelements with insubstantial differences from the literal language of theclaims.

What is claimed is:
 1. An imaging system comprising: a gantry having abore therethrough; plural radiation detector head assemblies disposedabout the bore of the gantry, each radiation detector head assemblycomprising a detector housing; and a rotor assembly disposed within thedetector housing and configured to be rotated about an axis, the rotorassembly comprising a detector unit comprising an absorption member andassociated processing circuitry, wherein the absorption member and theassociated processing circuitry are disposed within the detectorhousing; a cooling unit mounted to the gantry and configured to providean output flow of air at a controlled temperature; and a manifoldcoupled to the cooling unit and the plural radiation detector headassemblies placing the cooling unit and plural radiation detector headassemblies in fluid communication with each other, wherein the outputflow of air from the cooling unit is delivered via the manifold to thedetector housings of the plural radiation detector head assemblies. 2.The imaging system of claim 1, wherein the cooling unit comprises athermoelectric chiller (TEC).
 3. The imaging system of claim 1, whereinthe cooling unit receives an inlet flow from an atmospheric source. 4.The imaging system of claim 1, wherein the cooling unit receives anexhaust flow from the plural radiation detector head assemblies.
 5. Theimaging system of claim 1, wherein the rotor assembly comprises a casingand fins extending along an exterior surface of the casing, wherein thefins are configured to have variable heat transfer capability along alength of the rotor assembly.
 6. The imaging system of claim 5, whereinthe fins have a variable height along the length of the rotor assembly.7. The imaging system of claim 5, wherein at least some of the fins havedifferent fin lengths, wherein the number of fins varies along thelength of the rotor assembly.
 8. The imaging system of claim 5, whereinthe fins have a variable thermal conductivity along the length of therotor assembly.
 9. The imaging system of claim 1, wherein the absorptionmember includes a pixelated detector having individually read pixels,wherein the imaging system further comprises a processing unitcomprising one or more processors and at least one memory comprising atangible and non-transitory computer readable storage medium includinginstructions configured to instruct the one or more processors to countevents detected by the detector units using a corresponding thresholdand window for each pixel, wherein at least one of the threshold or thewindow are individually tailored for each pixel.
 10. The imaging systemof claim 9, wherein the instructions are further configured to instructthe one or more processors to adjust at least one of the threshold orthe window for at least one pixel during imaging.
 11. An imaging systemcomprising: a pixelated detector having individually read pixels; and aprocessing unit comprising one or more processors and at least onememory comprising a tangible and non-transitory computer readablestorage medium including instructions configured to instruct the one ormore processors to count events detected by the detector units using acorresponding threshold and window for each pixel, wherein at least oneof the threshold or the window are individually tailored for each pixel,wherein the window is an energy window defined by an upper energyboundary corresponding to a higher energy level and a lower energyboundary corresponding to a lower energy level, wherein at least one ofthe upper energy boundary or the lower energy boundary of the window isadjusted based on a leading edge of a corresponding spectrum produced bythe at least one pixel, the leading edge defined at a predefinedfraction of a height of a peak of the spectrum.
 12. The imaging systemof claim 11, wherein the instructions are further configured to instructthe one or more processors to adjust at least one of the threshold orthe window for at least one pixel during imaging.
 13. The imaging systemof claim 12, wherein the instructions are further configured to instructthe one or more processors to adjust the window based on a sensedtemperature.
 14. The imaging system of claim 11, wherein theinstructions are further configured to instruct the one or moreprocessors to individually set the threshold for each pixel based on aprocessing capability.
 15. The imaging system of claim 11, wherein theinstructions are further configured to instruct the one or moreprocessors to individually set the window for each pixel based oncharacteristics of the pixel.
 16. A method comprising: acquiringradiation events with a pixelated detector having individually readpixels; and counting, with a processing unit comprising at least oneprocessor, the events detected by the pixelated detector using acorresponding threshold and window for each pixel, wherein at least oneof the threshold or the window are individually tailored for each pixel,wherein the window is an energy window defined by an upper energyboundary corresponding to a higher energy level and a lower energyboundary corresponding to a lower energy level, wherein at least one ofthe upper energy boundary or the lower energy boundary of the window isadjusted based on a leading edge of a corresponding spectrum produced bythe at least one pixel, the leading edge defined at a predefinedfraction of a height of a peak of the spectrum.
 17. The method of claim16, further comprising adjusting at least one of the threshold or thewindow for at least one pixel during imaging.
 18. The method of claim17, further comprising adjusting the window based on a leading edge of acorresponding spectrum produced by the at least one pixel.
 19. Themethod of claim 17, further comprising adjusting the window based on asensed temperature.